Substrate transfer chamber and container connecting mechanism

ABSTRACT

A substrate transfer chamber for unloading the substrates from the containers includes a housing-shaped main body and a plurality of container connecting mechanisms to which the containers are connected. In the main body, some of the container connecting mechanisms are arranged on top of one another in a height direction of the main body.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to Japanese Patent Application No.2013-210090 filed on Oct. 7, 2013, the entire contents of which areincorporated herein by reference.

FIELD OF THE INVENTION

The present invention relates to a substrate transfer chamber and acontainer connecting mechanism.

BACKGROUND OF THE INVENTION

A plasma processing system for performing plasma processing on asubstrate, e.g., a semiconductor wafer (hereinafter, simply referred toas “wafer”) includes a process module serving as a vacuum plasmaprocessing chamber, and a loader module serving as an atmospherictransfer chamber for loading and unloading the wafer into and from acontainer, e.g., a front opening unified pod (FOUP), accommodating aplurality of wafers.

In the plasma processing system, the wafer is unloaded from the FOUPconnected to a container connecting mechanism (load port) of the loadermodule and then loaded into the process module through the loadermodule, a load-lock module serving as an atmosphere/vacuum switchablechamber and a transfer module serving as a vacuum transfer chamber.

In consideration of the plasma process efficiency, the plasma processingsystem generally includes a plurality of process modules. Therefore, theloader module has a plurality of, e.g., three, load ports tosimultaneously load wafers into the respective process modules. The loadports are arranged linearly on one side surface of a housing-shapedloader module (see, e.g., Japanese Patent Application Publication No.2006-261456).

Recently, the number of process modules of the plasma processing systemincreases in view of throughput improvement. For example, there isdeveloped a plasma processing system including six process modules. Insuch a plasma processing system, different processes may be performed inthe respective process modules depending on the modes of the respectiveprocess modules. Specifically, the process modules and wafer lots aremade to correspond to one another, and each of the process modules mayprocess only wafers in a lot corresponding thereto. In that case, wafersare transferred between a load port and a single process module withoutbeing sequentially transferred between the process modules. Thus, inorder to minimize a period of time during which the process modules arebeing empty, load ports are preferably provided such that the number ofthe load ports is equal to or greater than the number of processmodules. In the above plasma processing system, it is preferable thatthe loader module has at least seven load ports.

However, in the case of arranging at least seven load ports linearly onone side surface of the loader module, a foot print of the loader moduleis increased, which makes it difficult to install the plasma processingsystem in a clean room. Especially, scaling up of a wafer diameter,specifically, from 300 mm to 450 mm, is expected, so that the problem ofthe increase in the foot print of the loader module becomes moresignificant.

SUMMARY OF THE INVENTION

In view of the above, the present invention provides a substratetransfer chamber and a container connecting mechanism, capable ofreducing increase in a foot print.

In accordance with an aspect of the present invention, there is provideda substrate transfer chamber, to which a plurality of containersaccommodating substrates is connected, for unloading the substrates fromthe containers, including: a housing-shaped main body; and a pluralityof container connecting mechanisms to which the containers areconnected. In the main body, some of the container connecting mechanismsare arranged on top of one another in a height direction of the mainbody.

BRIEF DESCRIPTION OF THE DRAWINGS

The objects and features of the present invention will become apparentfrom the following description of embodiments, given in conjunction withthe accompanying drawings, in which:

FIG. 1 is a top view schematically showing a configuration of asubstrate processing system including a substrate transfer chamber(loader module) in accordance with an embodiment of the presentinvention;

FIG. 2 is a front view schematically showing a configuration of theloader module shown in FIG. 1;

FIG. 3 is a side view schematically showing the configuration of theloader module shown in FIG. 1, as seen from a direction of an arrow inFIG. 2;

FIGS. 4A and 4B show a configuration of a pair of an upper and a lowerload port shown in FIGS. 2 and 3, wherein FIG. 4A is a side view andFIG. 4B is a front view;

FIGS. 5A and 5B schematically show a configuration of a modification ofthe upper load port, wherein FIG. 5A is a rear view and FIG. 5B is aside view;

FIG. 6 is a front view schematically showing a configuration of themodification of the loader module; and

FIG. 7 is a side view schematically showing the modification of theloader module, as seen from a direction of an arrow in FIG. 6.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Hereinafter, embodiments of the present invention will be described withreference to the accompanying drawings which form a part hereof.

FIG. 1 is a top view schematically showing a configuration of asubstrate processing system including a substrate transfer chamber(loader module) in accordance with an embodiment of the presentinvention. In FIG. 1, components in the system are illustrated to beseen through for convenience of explanation.

In FIG. 1, a substrate processing system 10 includes: a transfer module11 serving as a vacuum transfer chamber formed in a substantiallyheptagonal shape when seen from the top; six process modules 13 a to 13f, serving as vacuum plasma processing chambers, which are arrangedradially around the transfer module 11 and connected to the transfermodule 11 through gate valves 12; two load-lock modules 14, serving asatmosphere/vacuum switchable chambers, which are connected to one sidesurface of the transfer module 11 where the process modules 13 a to 13 fare not connected; and a loader module 15, serving as an atmospherictransfer chamber, which is connected to the load-lock modules 14 at theopposite side to the transfer module 11.

The transfer module 11 has therein a transfer mechanism 16 fortransferring a wafer W between the process modules 13 a to 13 f orbetween the process modules 13 a to 13 f and the load-lock modules 14. Apressure in the transfer module 11 is depressurized to a predeterminedvacuum level.

Each of the process modules 13 a to 13 f has a single stage 17 formounting thereon the wafer W. A pressure in the respective processmodules 13 a to 13 f is depressurized to a predetermined vacuum level.In the respective process modules 13 a to 13 f, a predetermined plasmaprocess, e.g., dry etching, is performed on the wafer W mounted on thestage 17.

The loader module 15 has a transfer robot 19 for transferring the waferW between the load-lock modules 14 and FOUPs 18, each accommodating aplurality of wafers W. A pressure in the loader module 15 is maintainedat an atmospheric pressure.

Each of the load-lock modules 14 has a stage 20 for mounting thereon thewafer W. The inner space of each load-lock module 14 can be switchedbetween an atmospheric environment and a depressurized environment. Forexample, when the wafer W is transferred by using the transfer robot 19in the loader module 15, the inner space of the load-lock module 14 isswitched to the atmospheric environment to communicate with the innerspace of the loader module 15. Further, when the wafer W is transferredby using the transfer mechanism 16 in the transfer module 11, the innerspace of the load-lock module 14 is switched to the depressurizedenvironment to communicate with the inner space of the transfer module11. In other words, the inner spaces of the load-lock modules 14 areswitched between the atmospheric environment and the depressurizedenvironment, and the wafer W is transferred between the transfer module11 and the loader module 15 via the load-lock modules 14.

FIG. 2 is a front view schematically showing a configuration of theloader module shown in FIG. 1. FIG. 3 is a side view schematicallyshowing the configuration of the loader module, as seen from a directionof an arrow in FIG. 2.

In FIGS. 2 and 3, the loader module 15 further includes a main body 21having a hexagonal housing shape when seen from the top, and a pluralityof load ports 22 each serving as a container connecting mechanism forconnecting the FOUP 18 to the main body 21.

The load ports 22 are disposed at a side surface 21 a of the loadermodule 15 opposite to a side surface of the loader module 15 where theload-lock modules 14 are connected and at two side surfaces 21 b and 21c adjacent to the side surface 21 a. Further, the load ports 22 arearranged on top of one another in a height direction of the main body 21(hereinafter, simply referred to as “height direction”). In the presentembodiment, the load ports 22 are classified into lower load ports 22 aand upper load ports 22 b, for convenience. Two pairs of lower and upperload ports 22 a and 22 b are disposed at the side surface 21 a, and onepair of lower and upper load port 22 a and 22 b is disposed at each ofthe side surfaces 21 b and 21 c.

Each of the load ports 22 includes a plate-shaped stage 23 extending ina horizontal direction from the main body 21, and a FOUP connecting port24 (container connecting port) that opens at a portion of the main body21 so as to face the FOUP 18 mounted on the stage 23. The FOUPconnecting port 24 is generally blocked by a shutter (not shown) or thelike. However, when the FOUP 18 is mounted on the stage 23 and connectedto the FOUP connecting port 24, the FOUP connecting port 24 opens and alid 18 a of the FOUP 18 which will be described later faces the FOUPconnecting port 24.

A port 25 a or a buffer 25 b extending in a horizontal direction fromthe main body 21 is provided above each pair of lower and upper loadports 22 a and 22 b. Each buffer 25 b is configured to temporarily placethereon the FOUP 18 transferred by a FOUP transfer unit 26 to bedescribed later.

The loader module 15 includes two FOUP transfer units (containertransfer units) that are disposed at a corner 21 d (see FIG. 1) formedby the side surfaces 21 a and 21 b of the main body 21 and a corner 21 e(see FIG. 1) formed by the side surfaces 21 a and 21 c of the main body21.

Each of the FOUP transfer unit 26 includes: a column 27 standing uprightin the height direction; a base 28 attached at the column 27 and movablein the height direction; a rotation base 29 disposed at the base 28 androtatable on a horizontal plane; a SCARA type arm 30 installed at aposition offset from the center of the rotation base 29; a couplingportion 31 provided at the leading end of the arm 30 and to be coupledto an upper portion of the FOUP 18. The FOUP transfer unit 26 transfersthe FOUP 18 between the load ports 22, the ports 25 a and the buffers 25b by the vertical movement of the base 28, the rotation of the rotationbase 29, and the extension/contraction of the arm 30.

FIGS. 4A and 4B show the configuration of the pair of the lower and theupper load port in FIGS. 2 and 3. FIG. 4A is a side view and FIG. 4B isa front view. In FIGS. 4A and 4B, the main body is omitted. In FIG. 4A,a lid-open-state is indicated by a dashed line. In FIG. 4B, a lowerlid-opening mechanism and an upper lid-opening mechanism which will bedescribed later are indicated by dashed lines.

In FIGS. 4A and 4B, the lower load port 22 a has a lower lid-openingmechanism 32 a that is disposed inside the main body 21 to detach thelid 18 a of the FOUP 18 facing the FOUP connecting port 24 and move thedetached lid 18 a in a downward direction in FIGS. 4A and 4B. The upperload port 22 b has an upper lid-opening mechanism 33 a that is disposedinside the main body 21 to detach the lid 18 a of the FOUP 18 facing theFOUP connecting port 24 and move the detached lid 18 a in an upwarddirection in FIGS. 4A and 4B.

The lower lid-opening mechanism 32 a includes: a coupling portion 32 bto be coupled to the lid 18 a; a rod 32 c, which is connected to thecoupling portion 32 b to extend and contract in the height direction; adriving unit 32 d for driving the rod 32 c. The upper lid-openingmechanism 33 a includes a coupling portion 33 b to be coupled to the lid18 a; a rod 33 c, which is connected to the coupling portion 33 b toextend and contract in the height direction; and a driving unit 33 d fordriving the rod 33 c.

In case two lower load ports 22 a are arranged on top of one another inthe height direction, the lower lid-opening mechanism 32 a of the upperone of the two lower load ports 22 a needs to be provided above thelower one of the two lower load ports 22 a. Since the FOUP connectingport 24 of the lower load port 22 a is disposed above the lowerlid-opening mechanism 32 a, the FOUP connecting port 24 of the upper oneof the two lower load ports 22 a needs to open at the upper portion ofthe main body 21. However, a space is required near the upper portion ofthe main body 21 to ensure a moving path of a container transfer unit(not shown) moving in a ceiling container transfer system (not shown).Therefore, it is difficult to dispose the FOUP 18 at the upper portionof the main body 21. As a result, it is difficult to make the FOUPconnecting port 24 open at the upper portion of the main body 21. Inother words, it is difficult to arrange two lower load ports 22 a on topof one another in the height direction due to the limited height in thearrangement of the FOUP connecting port 24.

On the other hand, in the present embodiment, the upper load port 22 bhaving the upper lid-opening mechanism 33 a is arranged above the lowerload ports 22 a. Since the FOUP connecting port 24 of the upper loadport 22 b is disposed below the upper lid-opening mechanism 33 a, it ispossible to arrange the upper load port 22 b above the lower load port22 a while ensuring a space near the upper portion of the main body 21.

FIGS. 5A and 5B schematically show a configuration of a modification ofthe upper load port. FIG. 5A is a rear view and FIG. 5B is a side view.In FIGS. 5A and 5B, the main body is omitted, and the lid-open-state isindicated by dashed lines.

In FIGS. 5A and 5B, the upper load port 34 has a lid-opening mechanism35, in addition to the FOUP connecting port 24, the stage 23 and thelike, which is disposed inside the main body 21 to detach the lid 18 aof the FOUP 18 facing the FOUP connecting port 24 and move the detachedlid 18 a in an inclined downward direction in FIG. 5A.

The lid-opening mechanism 35 includes: a coupling portion 35 a to becoupled to the lid 18 a; two swing arms 35 b connected to the couplingportion 35 a and arranged in parallel to each other in the heightdirection; and a driving unit 35 c for driving the two swing arms 35 b.Each of the two swing arms 35 b swings about one end thereof on a planein the height direction (vertical plane), thereby moving the couplingportion 35 a together with the lid 18 a in the inclined downwarddirection in FIG. 5A.

Meanwhile, in the lower lid-opening mechanism 32 a, the rod 32 c needsto be extended in a height direction by a distance greater than or equalto the height of the lid 18 a in order to remove the lid 18 a from theFOUP connecting port 24 and open the FOUP connecting port 24. Further,the rod 32 c and the driving unit 32 d need to be arranged linearlyalong the height direction in order to drive the rod 32 c in the heightdirection. Thus, the lower lid-opening mechanism 32 a requires apredetermined length in the height direction. However, in thelid-opening mechanism 35, the lid 18 a is removed by swing operation ofthe two swing arms 35 b. Therefore, it is unnecessary to arrange thedriving unit 35 c and the two swing arms 35 b linearly along the heightdirection. Accordingly, the length of the lid-opening mechanism 35 inthe height direction does not need to be as large as that of the lowerlid-opening mechanism 32 a.

As a result, the upper load port 34, instead of the upper load port 22b, can be arranged above the lower load ports 22 a while ensuring aspace near the upper portion of the main body 21.

In accordance with the loader module 15 serving as the substratetransfer chamber of the present embodiment, the lid-opening mechanisms33 a and 35 of the respective upper load ports 22 b and 34 remove thelid 18 a of the FOUP 18 from the FOUP connecting port 24 in an upward oran inclined downward direction. Therefore, the upper load port 22 b orcan be arranged above the lower load port 22 a in the height direction.In other words, in the loader module 15, the upper load port 22 b or 34can be arranged above the lower load port 22 a in the height direction,and thus it is unnecessary to expand the main body 21 in the widthdirection to install a plurality of load ports 22. Accordingly, theincrease in the foot print of the loader module 15 can be reduced.

In the above-described loader module 15, a plurality of load ports 22 isseparately arranged at the side surfaces 21 a to 21 c of the main body21. Hence, it is unnecessary to expand only one side surface of the mainbody 21 in the width direction to install the plurality of load ports22.

Further, in the above-described loader module 15, two FOUP transferunits 26, each having an extensible/contractible arm 30, are disposed atthe corner 21 d formed by the side surfaces 21 a and 21 b and the corner21 e formed by the side surfaces 21 a and 21 c. Hence, the FOUP 18 canbe smoothly transferred to each of the load ports 22 even in case wherethe load ports 22 are separately arranged at the side surfaces 21 a to21 c.

While the embodiments of the present invention have been described, thepresent invention is not limited to the above embodiments.

For example, the load module 15 does not necessarily have eight loadports 22. The number of load ports 22 may be at least greater than orequal to the number of process modules 13. For example, as shown inFIGS. 6 and 7, the loader module 15 may have seven load ports 22. Inthis case, two lower load ports 22 a and one upper load port 22 b arearranged at the side surface 21 a.

While the invention has been shown and described with respect to theembodiments, it will be understood by those skilled in the art thatvarious changes and modifications may be made without departing from thescope of the invention as defined in the following claims.

What is claimed is:
 1. A substrate transfer chamber, to which aplurality of containers accommodating substrates is connected, forunloading the substrates from the containers, comprising: ahousing-shaped main body; and a plurality of container connectingmechanisms to which the containers are connected, wherein, in the mainbody, some of the container connecting mechanisms are arranged on top ofone another in a height direction of the main body.
 2. The substratetransfer chamber of claim 1, the container connecting mechanisms areseparately disposed at two or more side surfaces of the main body. 3.The substrate transfer chamber of claim 2, further comprising: containertransfer units, each having an extensible/contractible arm, configuredto transfer the containers to the container connecting mechanisms,wherein the container transfer units are respectively disposed atcorners of the main body.
 4. The substrate transfer chamber of claim 1,further comprising buffers configured to temporarily place thereon thecontainers.
 5. A container connecting mechanism comprising: a containerconnecting port to which a container with a lid accommodating substratesis connected; and a lid-opening mechanism configured to detach the lidfrom the container connected to the container connecting port, whereinthe lid-opening mechanism moves the lid detached from the containerconnecting port in an upward direction.
 6. A container connectingmechanism comprising: a container connecting port to which a containerwith a lid accommodating substrates is connected; and a lid-openingmechanism configured to detach the lid from the container connected tothe container connecting port, wherein the lid-opening mechanism movesthe lid detached from the container connecting port in an inclineddirection.